In our glossary you will find all the important terms and abbreviations relating to packaging technology in electronics.
- Active power cycling (PCT)
- Power Cycling Test (PCT)
- Alloy
- Solder alloy
- Aluminum nitride
- Active Metal Brazing Substrate (AMB)
- Automatic optical inspection (AOI)
- Batch process
- batch oven
- Bonding
- Bondline thickness (BLT)
- C-Scan
- C-SAM
- Chip tilt
- Die tilt
- Coefficient of linear thermal expansion (CTE)
- Conduction
- Heat transfer
- Conduction soldering
- Continuous oven
- Tunnel oven
- Inline furnace
- Conveyor oven
- CTE-Mismatch
- Cycle time
- Takt time
- Data logger
- Temperature profiler
- Direct Bonded Copper Substrate (DBC)
- DCB Substrate (DBC)
- Direct Copper Bonding Substrate (DBC)
- Direct Bonded Copper Substrate (DBC)
- Delamination
- Detachment
- Dewetting
- Diffusion soldering (TLPS)
- Transient Liquid Phase Bonding (TLPS)
- Transient Liquid Phase Sintering (TLPS)
- Diffusion bonding (TLPS)
- Digital image correlation (DIC)
- Stereo image correlation (DIC)
- Directive on the restriction of the use of hazardous substances in electrical and electronic equipment (RoHS)
- Double sided cooled module (DCM)
- Dual side cooled module (DCM)
- Electronic devices
- Electrical components
- Electrical device
- Electronics packaging
- Assembly technology
- Joining technology
- Eutecticum
- Flux
- Flux coated preform
- Flux-free soldering
- Formic acid
- HCOOH
- Formic acid soldering (HCOOH soldering)
- Full convection soldering
- Hot air soldering
- Gallium arsenide (GaAs)
- Gallium-Nitride (GaN)
- Gel-Pack
- Gluing
- Adhesive bonding
- Hard soldering
- Brazing
- Highly Accelerated Life Testing (HALT)
- Highly Accelerated Stress Screening (HASS)
- Highly Accelerated Stress Testing (HASS)
- Hot tacking
- Hot pick&place
- Hydrogen (H2)
- Hydrogen soldering (H2 soldering)
- Forming gas soldering (H2 soldering)
- In-line concept
- Throughput concept
- Inertizing
- Atmospheric cleaning
- Cleaning cycles
- Infrared soldering (IR-soldering)
- IPC Standard (IPC)
- Island concept
- Joint Electron Device Engineering Council (JEDEC)
- Large area sintering (LAS)
- Base plate sintering (LAS)
- System sintering (LAS)
- Heat sink sintering (LAS)
- Liquidus
- Melting temperature
- melting point
- Load cycle
- Load change
- Low temperature joining technology (LTJT)
- Sintering; Low temperature bonding technology (LTJT)
- Mandrel bending test
- Measurement dummy
- Measurement assembly
- Melting range
- Metallic sintering
- Diffusion bonding
- Solid-state bonding
- MIL Standard
- Nitrogen (N2)
- Optical inspection
- Overall Equipment Effectivenes (OEE)
- Overall Asset Effectiveness (OEE)
- Overpressure soldering
- Atmospheric compression soldering
- Paste printing
- Screen printing
- stencil printing
- solder paste printing
- Pick and place machine (P&P)
- Die bonder (P&P)
- Chip bonder (P&P)
- Plasma
- Plasma activation
- Plasma cleaning
- Porosity
- Power electronics
- Power module
- Preform
- Solder preform
- Print image
- Printed Circuit Board
- Process time
- Process duration
- Product carrier
- Conveyor
- Tray
- Qualification tests
- Quality control charts
- Run chart
- Raised edges
- Ramping
- Reducing agent
- Reflow soldering
- Residual moisture
- Humidity
- Residual oxygen content (O2-content)
- Residual stress
- Rework
- Scanning Acoustic Microscopy (SAM)
- Ultrasonic microscopy (SAM)
- Scoop out
- Screen printing
- Semiconductor chip
- Bare die
- dies
- chips
- Sheartest
- Shrinkage void
- Fjord void
- Worm trench
- solidification void
- Silicon
- Silicon carbide (SiC)
- Sinter paste
- Slumping
- Bleed-out
- Soft soldering
- Softvacuum
- Solder paste
- Solder splashes
- Solder balls
- solder balling
- soldering spheres
- soldering balls
- Solderability matrix
- Soldering fixture
- Soldering jig
- alignment jig
- Soldering profile
- Temperature profile
- Temperature curve
- Solderpaste inspection (SPI)
- Solidus
- Squeegee
- Statistical process control (SPC)
- Stencil printing
- Substrate
- Surface mount device (SMD)
- Surface Mount Technology (SMT)
- Tacking agent
- Adhesive agent
- Temperature cycling test (TCT)
- Temperature gradient dT/dt
- Temperature shock test (TST)
- Thermo-mechanical stresses
- Thermocompression bonding
- Metal diffusion bonding
- Thermocouple (TC)
- Thermal element (TC)
- Thermosonic bonding
- Eutectic Scrub
- Throughput
- Time above liquidus (TAL)
- Time over liquidus (TAL)
- Tin dust
- Tin fog
- Tin-silver-copper solders (SAC)
- SAC solders (SAC)
- Sn-Ag-Cu solders (SAC)
- Torque test
- Ultrasonic welding
- Units per hours (UPH)
- Vacuum
- Negative pressure
- Vacuum soldering
- Vapor phase soldering
- Void rate
- Voids
- Wafer
- Waffle-Pack
- Warpage
- Bending
- Curvature
- Arching
- Welding
- Wetting
- Wire bonding
- X-Ray inspection (X-ray)
- Yield
- Scrap