04 Feb 2024 Thermosonic bonding
Refers to the joining of semiconductors to substrates using temperature and ultrasonic energy. Gold solders or gold surfaces are often used. The process is also known as eutectic scrubbing if a eutectic solder such as Au80Sn20 is used. Ultrasonic energy can be used to bring the preheating temperature below the melting point. In some cases, however, scrubbing is simply a vibrating movement to remove voids from the molten solder. The solder is brought above the melting point and the scrubbing process is then started.