12 Jan 2024 Electronics packaging
Refers to the materials and production technologies used to bond electronic components onto circuit boards. Soldering components onto printed circuit boards is a classic bonding technique. Other joining techniques are welding, sintering and gluing.
The packaging technology must fulfill several functions of the assembly:
- Mechanical connection for fixing the components
- Electrical contacting of the circuit
- Thermal connection for heat dissipation
The functions are made possible by the choice of materials and joining techniques.