Low temperature joining technology (LTJT)

Describes the bonding of semiconductors or other electronic components to a circuit carrier metallic sintering. The term low temperature stands for the joining temperature. In silver sintering, this is usually in the range 200…300°C, while the melting point of silver is 962°C. The sintering process therefore takes place at a significantly lower temperature compared to the liquid temperature of the material. This is in contrast to conventional soldering, in which the solder material melts completely and forms a liquid phase.

Copper sintering powder is another material used in sintering technology. As with silver sintering, copper particles are sintered at 200…300°C, while the melting point of copper is 1083°C.

Sintering; Low temperature bonding technology
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