In close collaboration with your team we analyse your production. This includes:
Interconnect device, material, surfaces, packaging
Storage conditions, shelf life, handling
Equipment, material flow, clean room conditions
Cycle times, temperature, process parameters, boundary conditions, testing
End-testing, packaging, delivery
At paste-free soldering with formic acid or hydrogen and preforms we evaluate the following process steps of your production:
For the mass production of electronic devices by metallic silver or copper sintering our focus is on:
Do you have further questions regarding production improvement? Do not hesitate to contact us!