Refers to possible moisture residues on or in components, e.g. after inspection using ultrasound microscopy. However, it can also refer to moisture residues in machines – e.g. soldering ovens.

For all thermal joining processes – whether soldering, sintering, welding, etc. – increased residual moisture must be avoided in all cases. The sudden evaporation can lead to defects in the joint. Condensates in the oven can also react with the solder or sinter paste and affecct reducing agents such as formic acid or hydrogen. A residual moisture content of