21 Jan 2024 Power module
Refers to a structure in power electronics consisting of ceramic substrates, power semiconductors and their contacting.
Al2O3-DCBs or AlN or Si3N4-AMBs with a copper layer on both sides are used for the ceramic circuit carriers. Depending on the connection technology, the copper can be silver-plated or nickel-plated.
For external contacting, load connections such as terminals are soldered or welded onto the copper.
For protection against environmental influences, the circuits are encapsulated with a silicone gel (soft encapsulation) and glued into a plastic housing or overmolded with an epoxy resin by transfer molding.
In many cases, the substrate is soldered or sintered onto a copper or aluminum base plate. These modules are referred to as base plate power modules. The base plates can in turn be manufactured with a cooling structure or a flat underside.