Tacking agent

Refers to a temporary adhesive used to hold components in the desired position before soldering or sintering. The movement of product carriers in the soldering or sintering system can cause the components to shift and therefore cause scrap. To prevent this, adhesives are dispensed or sprayed on during the placement process. The bonding agent then evaporates at approx. 100…200°C before the solder melts or the sintering reaction takes place.

Adhesive agent
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