Vacuum soldering with paste

For vacuum soldering with pastes – especially in conduction furnaces – some points have to be considered during process development. The adjustment of the atmospheric pressure and the oxygen concentration results in new degrees of freedom, but also stumbling blocks. This includes for example, the controlled removal of paste residues by vacuum. However, activators of the paste can also lose their effect due to wrong vacuum setting, resulting in poor wetting.

For this reason, we offer special training and process consulting for vacuum soldering with paste.

Possible training and project contents:

  • Development of soldering profiles with conduction ovens
  • Typical faults that arise during soldering and temperature profiling
  • Temperature measurement techniques and sources of errors
  • Influence of previous processes on the paste soldering
  • Material quality check, soldering jigs and fixtures, as well as systems with rapid testing functions
  • Identification of save process windows
  • Transfer of laboratory processes to mass production
  • Introduction of inline measurements and statistical process control
seminars for data science

Articles about paste soldering:

  • This article discusses the high-lead exemption for electronics, potential alternatives and what would happen if manufactures had to replace Pb. ...

  • Paste soldering in conduction systems (contact heating) with vacuum has several advantages over conventional soldering methods in hot air systems (convection). Due to the controlled atmospheres, paste residues can be specifically extracted and oxidation can be prevented. Furthermore, void rates of <10% are possible. In the training you will learn what you have to pay attention to when soldering paste with vacuum....

Do you have further questions regarding vacuum soldering? Do not hesitate to contact us!