This is a bonding process for joining two or more joining partners. In contrast to soldering, no additional material (solder) is required because the parts to be welded are joined together directly.

Ultrasonic welding in the form of wire bonding is particularly relevant for electronics. In this process, ultrasonic energy is used to liquefy the interconnection and create a material bond. Ultrasonic welding or laser welding is also used for terminal bonding of power modules.