Vacuum soldering

Refers to all soldering processes in which a vacuum chamber or negative pressure is used to extract trapped air pockets from the liquid solder and thus prevent defects. Depending on the vacuum chamber and pump, the final pressure is usually between 0.1 and 10 mbar. This corresponds to a rough vacuum (up to 1mbar) or the upper range of a fine vacuum. With vacuum soldering, the proportion of defects can be

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