Presentation about large area sintering and slot nozzle dispensing at FED Conference
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
Metallic sintering with copper or silver pastes has proven to be a highly reliable alternative to soldering. Especially the pressure-assisted sintering process delivers superior results in regards to cycle times, application temperature and lifetime, compared to soft soldering. However, in order to achieve a reliable connection, a pressure-force of 10 to 30 MPa is required. Moreover, a precise temperature control and clean surfaces are mandatory for a high-quality sinter joint.
We offer advanced silver and copper sintering training opportunities with a holistic view on the sintering line, as well as workshops dealing with and boundary conditions, such as material quality.
Originally published by Schwarzbauer in 1989, in recent years metallic silver sintering has proven to be a much more reliable alternative to soft soldering in power electronics. In addition to numerous dissertations, several industrial companies have also dealt with the subject and are currently working on transferring the process to series production.
Sintering is generally a process technology to produce materials with a certain density from metallic or ceramic powders by means of thermal energy. The driving force of sintering is that a powder passes from a high-energy to a lower-energy state. This is done by minimizing the surface energy of the particles through the sintering process. This process is accelerated by pressure and temperature.
Metallic silver sintering is solid phase sintering. Here, particles are present in paste form together with encapsulating and dispersing agents as well as organic binders. The paste is applied to the substrate by stencil or screen printing or by dispensing and then dried. The chip is sintered to the substrate by the silver particles in one to two minutes at a pressure of up to 50 MPa and temperatures of 200 °C to 300 °C.
Since the sintering reaction takes place at a temperature significantly below the melting temperature, the process is also known as low-temperature joining technology (LTJT). In most cases, LTJT requires a precious metal surface of the joining partners, whereby sintering pastes for copper surfaces are currently under development. The LTJT shows an order of magnitude better temperature and power cycling capability. The reason for this is the electrical and thermal conductivity, which is four times higher, as well as the five times higher yield strength and the 15% lower thermal expansion of pure silver compared to SAC solders. At 962 °C, the melting point of silver is significantly higher than that of soft solder alloys. This makes the material ideal for high temperature applications.
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
You are looking for sintering introduction support? We help you to find the best solution for your application....
Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....
Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the comparison with baking is suitable. The preparation of the paste, the temperature and processing is quite similar to baking a pizza or a sandwich. ...
Do you have further questions regarding metallic sintering? Do not hesitate to contact us!