18 Sep 2024 Workshop presentation: Surface Finishes and Sinterable Metallisations
Presentation at the ECPE Hybrid Workshop Sinter Technology in Power Electronics....
07 Sep 2024 Conference presentation: real time formic acid measurement
Dr. Aaron Hutzler will give a presentation of our latest formic acid measurement result at the ESTC Conference in Berlin....
11 May 2024 PCIM Seminar: Flux free soldering and pressure sintering
Finally, Bond Pulse will offer a public seminar....
16 Jan 2024 New article: Motivation for metallic sintering
Our new article on the motivation behind sintering power semiconductors was published today in Semiconductor Packaging News...
16 Aug 2023 Discovering Alternatives for High Lead Solders in Electronics
This article discusses the high-lead exemption for electronics, potential alternatives and what would happen if manufactures had to replace Pb. ...
15 Aug 2023 Presentation about large area sintering and slot nozzle dispensing at FED Conference
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
08 May 2023 Sintering introduction support for newcomers
You are looking for sintering introduction support? We help you to find the best solution for your application....
29 Mar 2020 New training: active power cycling
We extend our offer to comprehensive training courses on the subject of active power cycling tests of modern electronics packaging technology....
16 Mar 2020 Current situation in the Corona crisis
Posted at 10:09h
in News
Due to the worldwide corona crisis and for the protection of our employees, we currently only offer online training and process optimization via Microsoft Teams / Remote. This concerns all national and international customers....
09 Jan 2020 High temperature power cycling tests with sinter / solder materials and SiC devices
Posted at 15:44h
in Active Power cycling, Lifetime Analysis, News, Paper, Silver sintering, Statistics, Vacuum soldering
Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....