17 Sep 2023 AI-powered Yield-Manager
Bond Pulse launches a new project: AI-assisted yield manager to optimize yield and quality in electronics manufacturing...
16 Aug 2023 Discovering Alternatives for High Lead Solders in Electronics
This article discusses the high-lead exemption for electronics, potential alternatives and what would happen if manufactures had to replace Pb. ...
15 Aug 2023 Presentation about large area sintering and slot nozzle dispensing at FED Conference
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
08 May 2023 Sintering introduction support for newcomers
You are looking for sintering introduction support? We help you to find the best solution for your application....
29 Mar 2020 New training: active power cycling
We extend our offer to comprehensive training courses on the subject of active power cycling tests of modern electronics packaging technology....
16 Mar 2020 Current situation in the Corona crisis
Due to the worldwide corona crisis and for the protection of our employees, we currently only offer online training and process optimization via Microsoft Teams / Remote. This concerns all national and international customers....
09 Jan 2020 High temperature power cycling tests with sinter / solder materials and SiC devices
Posted at 15:44h
in Active Power cycling, Lifetime Analysis, News, Paper, Silver sintering, Statistics, Vacuum soldering 0 Comments
Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....
20 Oct 2019 New Cluster-Training: Reliability and lifetime of electronic systems
In this new cluster training course, you will learn the basics of lifetime and reliability analysis for electronic systems – for both system design and verification by simulation and testing. ...
02 Oct 2019 Meet Aaron Hutzler at the International Symposium on Advanced Power Packaging in Osaka, Japan
Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
22 Sep 2019 New training: Paste soldering with vacuum conduction ovens
Paste soldering in conduction systems (contact heating) with vacuum has several advantages over conventional soldering methods in hot air systems (convection). Due to the controlled atmospheres, paste residues can be specifically extracted and oxidation can be prevented. Furthermore, void rates of <10% are possible. In...
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