17 Sep 2019 Process development for flux-free soldering with preforms (Part 4)
In part four of the article series Process development for fluxless soldering we deal with the process window and process control....
10 Sep 2019 Process development for flux-free soldering with preforms (Part 3)
In the third part of the article series process development for flux-free soldering we deal with temperature measurement, profiling, wetting and soldering tests....
03 Sep 2019 Process development for flux-free soldering with preforms (Part 2)
In part 2 of the article series "Process development for flux-free soldering", we deal with the solder alloy and the effective temperature of the reducing agent....
27 Aug 2019 Process development for flux-free soldering with preforms (Part 1)
Compared to standard reflow soldering with paste, the process development for paste-free soldering is much more elaborate. It is crucial to consider the quality requirements of the product from the very beginning. A preform is defined as a rolled metal sheet that consists solely of...
03 Aug 2019 Introduction to reliability and lifetime analysis of electronic systems and devices
This article describes the statistical reliability and lifetime analysis with the focus on electronic devices. It contents the basics of statistical methods. These include lifetime distributions for electronic components, hypothesis tests and quality of data characteristics. Practical data analysis is also part of this paper....
19 Apr 2019 Influences on the quality at paste-free soldering
In our previous article we discussed that paste-free (flux-free) soldering is like cooking. You need the best ingredients and equipment to achieve great results. In this article, the main influences on quality of the soldering results are described. Nowadays, the flux-free soldering process is an...
17 Apr 2019 Metallic sintering is like high-end baking
Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the...
17 Apr 2019 Vacuum soldering is like an award winning cousine
Over the last 20 years, flux-free and paste-free vacuum soldering with preforms and formic acid has gained high importance for electronics packaging. Especially for big area solder joints within power modules for electric cars, this soldering technology can achieve void rates below 1%. This would...