16 Jan 2024 New article: Motivation for metallic sintering
Our new article on the motivation behind sintering power semiconductors was published today in Semiconductor Packaging News...
Our new article on the motivation behind sintering power semiconductors was published today in Semiconductor Packaging News...
Bond Pulse launches a new project: AI-assisted yield manager to optimize yield and quality in electronics manufacturing...
This article discusses the high-lead exemption for electronics, potential alternatives and what would happen if manufactures had to replace Pb. ...
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
You are looking for sintering introduction support? We help you to find the best solution for your application....
We extend our offer to comprehensive training courses on the subject of active power cycling tests of modern electronics packaging technology....
Due to the worldwide corona crisis and for the protection of our employees, we currently only offer online training and process optimization via Microsoft Teams / Remote. This concerns all national and international customers....
Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....
In this new cluster training course, you will learn the basics of lifetime and reliability analysis for electronic systems – for both system design and verification by simulation and testing. ...
Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...