Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
In part four of the article series Process development for fluxless soldering we deal with the process window and process control....
In the third part of the article series process development for flux-free soldering we deal with temperature measurement, profiling, wetting and soldering tests....
In part 2 of the article series "Process development for flux-free soldering", we deal with the solder alloy and the effective temperature of the reducing agent....
Compared to standard reflow soldering with paste, the process development for paste-free soldering is much more elaborate. It is crucial to consider the quality requirements of the product from the very beginning. A preform is defined as a rolled metal sheet that consists solely of...
This article describes the statistical reliability and lifetime analysis with the focus on electronic devices. It contents the basics of statistical methods. These include lifetime distributions for electronic components, hypothesis tests and quality of data characteristics. Practical data analysis is also part of this paper....
In our previous article we discussed that paste-free (flux-free) soldering is like cooking. You need the best ingredients and equipment to achieve great results. In this article, the main influences on quality of the soldering results are described. Nowadays, the flux-free soldering process is an...
Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the...
Over the last 20 years, flux-free and paste-free vacuum soldering with preforms and formic acid has gained high importance for electronics packaging. Especially for big area solder joints within power modules for electric cars, this soldering technology can achieve void rates below 1%. This would...