Preform

The solder in the form of a rolled and punched metal plate is referred to as a preform. In contrast to solder paste, it is a pure solder alloy. The width and length of the platelet are exactly the same size as the semiconductor or substrate to be soldered. The thickness depends on the curvature of the components and is usually between 100µm and 300µm.

Synonyms:
Solder preform
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