Refers to a power module in a sandwich structure that is cooled from below and above. Conventional power modules are only cooled on the substrate side or bottom side. Double-sided modules, on the other hand, are connected on the top side with ceramic circuit carriers instead of bonding wires. This means that these modules can be cooled from both sides. Due to the doubling of the cooling surface, the thermal resistance is reduced biquadratically (factor high-four).