Describes the temperature curve during the soldering process. The heating and cooling ramps as well as the time above the melting point are important for the soldering profile. Soldering profiles for solder paste are defined in the JEDEC/IPC J-STD-020 standard. A detailed explanation of the soldering profiles according to the standard is explained here.

A different profile is used for flux-free soldering with formic acid or hydrogen, as the soaking temperature and time of the acid must be taken into account. However, the exact temperature profile is not specified in a standard.