Refers to the tacking of semiconductors onto pre-dried sinter paste. The nozzle and the substrate with the paste are preheated to approx. 120°C in the automatic placement machine. The semiconductor is then pressed into the paste at approx. 0.5…1 MPa for 0.1…3s. This activates the lipid acids in the paste and temporarily bonds the semiconductor to the sintering paste. This in turn enables the semiconductor to be transported from the pick-and-place machine to the sintering press or protective films to be applied for sintering without the semiconductor shifting.