Direct Bonded Copper Substrate (DBC)

Refers to a ceramic circuit carrier in which copper is bonded to a ceramic. The connection is realized with the so-called DCB or DBC process.

DCB stands for Direct Copper Bonding and DBC for Direct Bonded Copper. Both abbreviations refer to the same process, in which the copper oxides of the copper layer are bonded with an oxide ceramic such as Aluminum-Oxide Al2O3 just below the melting point of copper, thus creating a copper-ceramic bond. Further information on the process can be found here.

DCB Substrate, Direct Copper Bonding Substrate, Direct Bonded Copper Substrate
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