Paste soldering in conduction systems (contact heating) with vacuum has several advantages over conventional soldering methods in hot air systems (convection). Due to the controlled atmospheres, paste residues can be specifically extracted and oxidation can be prevented. Furthermore, void rates of <10% are possible. In...

This article describes the statistical reliability and lifetime analysis with the focus on electronic devices. It contents the basics of statistical methods. These include lifetime distributions for electronic components, hypothesis tests and quality of data characteristics. Practical data analysis is also part of this paper....

In our previous article we discussed that paste-free (flux-free) soldering is like cooking. You need the best ingredients and equipment to achieve great results. In this article, the main influences on quality of the soldering results are described. Nowadays, the flux-free soldering process is an...

Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the...