Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....
Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
In this training you will learn to deal with all important aspects (thermo-mechanics, thermal management, surfaces) in the design of solder fixtures / jigs. ...
In part four of the article series Process development for fluxless soldering we deal with the process window and process control....
In the third part of the article series process development for flux-free soldering we deal with temperature measurement, profiling, wetting and soldering tests....
In this training you will learn the basics and requirements of the vacuum soldering process which will be illustrated and documented using practical examples. ...
In part 2 of the article series "Process development for flux-free soldering", we deal with the solder alloy and the effective temperature of the reducing agent....
Compared to standard reflow soldering with paste, the process development for paste-free soldering is much more elaborate. It is crucial to consider the quality requirements of the product from the very beginning. A preform is defined as a rolled metal sheet that consists solely of...
In our previous article we discussed that paste-free (flux-free) soldering is like cooking. You need the best ingredients and equipment to achieve great results. In this article, the main influences on quality of the soldering results are described. Nowadays, the flux-free soldering process is an...
Over the last 20 years, flux-free and paste-free vacuum soldering with preforms and formic acid has gained high importance for electronics packaging. Especially for big area solder joints within power modules for electric cars, this soldering technology can achieve void rates below 1%. This would...