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09 Jan 2020 High temperature power cycling tests with sinter / solder materials and SiC devices

Posted at 15:44h in Active Power cycling, Lifetime Analysis, News, Paper, Silver sintering, Statistics, Vacuum soldering 0 Comments

Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....

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02 Oct 2019 Meet Aaron Hutzler at the International Symposium on Advanced Power Packaging in Osaka, Japan

Posted at 11:05h in Copper sintering, News, Paper, Silver sintering, Vacuum soldering 0 Comments

Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...

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18 Sep 2019 New training: Development of soldering fixtures

Posted at 14:16h in News, Vacuum soldering 0 Comments

In this training you will learn to deal with all important aspects (thermo-mechanics, thermal management, surfaces) in the design of solder fixtures / jigs. ...

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17 Sep 2019 Process development for flux-free soldering with preforms (Part 4)

Posted at 18:41h in Data science, News, Paper, Statistics, Vacuum soldering 0 Comments

In part four of the article series Process development for fluxless soldering we deal with the process window and process control....

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10 Sep 2019 Process development for flux-free soldering with preforms (Part 3)

Posted at 22:43h in News, Paper, Vacuum soldering 0 Comments

In the third part of the article series process development for flux-free soldering we deal with temperature measurement, profiling, wetting and soldering tests....

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10 Sep 2019 New training: Process development for flux-free vacuum soldering

Posted at 11:22h in News, Vacuum soldering 0 Comments

In this training you will learn the basics and requirements of the vacuum soldering process which will be illustrated and documented using practical examples. ...

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03 Sep 2019 Process development for flux-free soldering with preforms (Part 2)

Posted at 22:30h in News, Paper, Vacuum soldering 0 Comments

In part 2 of the article series "Process development for flux-free soldering", we deal with the solder alloy and the effective temperature of the reducing agent....

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27 Aug 2019 Process development for flux-free soldering with preforms (Part 1)

Posted at 21:59h in Data science, News, Paper, Vacuum soldering 0 Comments

Compared to standard reflow soldering with paste, the process development for paste-free soldering is much more elaborate. It is crucial to consider the quality requirements of the product from the very beginning. A preform is defined as a rolled metal sheet that consists solely of...

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Quality inspection

19 Apr 2019 Influences on the quality at paste-free soldering

Posted at 10:13h in News, Paper, Vacuum soldering 0 Comments

In our previous article we discussed that paste-free (flux-free) soldering is like cooking. You need the best ingredients and equipment to achieve great results. In this article, the main influences on quality of the soldering results are described. Nowadays, the flux-free soldering process is an...

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Steak Medium

17 Apr 2019 Vacuum soldering is like an award winning cousine

Posted at 08:16h in News, Paper, Vacuum soldering 0 Comments

Over the last 20 years, flux-free and paste-free vacuum soldering with preforms and formic acid has gained high importance for electronics packaging. Especially for big area solder joints within power modules for electric cars, this soldering technology can achieve void rates below 1%. This would...

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