16 Jan 2024 New article: Motivation for metallic sintering
Our new article on the motivation behind sintering power semiconductors was published today in Semiconductor Packaging News...
Our new article on the motivation behind sintering power semiconductors was published today in Semiconductor Packaging News...
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
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Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the...