07 Sep 2024 Conference presentation: real time formic acid measurement
Dr. Aaron Hutzler will give a presentation of our latest formic acid measurement result at the ESTC Conference in Berlin....
16 Aug 2023 Discovering Alternatives for High Lead Solders in Electronics
This article discusses the high-lead exemption for electronics, potential alternatives and what would happen if manufactures had to replace Pb. ...
15 Aug 2023 Presentation about large area sintering and slot nozzle dispensing at FED Conference
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
09 Jan 2020 High temperature power cycling tests with sinter / solder materials and SiC devices
Posted at 15:44h
in Active Power cycling, Lifetime Analysis, News, Paper, Silver sintering, Statistics, Vacuum soldering
Study on the high temperature power cycling capability of SiC-Modules with silver sinter, gold germanium, tin-silver-copper and high lead solders....
02 Oct 2019 Meet Aaron Hutzler at the International Symposium on Advanced Power Packaging in Osaka, Japan
Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
17 Sep 2019 Process development for flux-free soldering with preforms (Part 4)
In part four of the article series Process development for fluxless soldering we deal with the process window and process control....
10 Sep 2019 Process development for flux-free soldering with preforms (Part 3)
In the third part of the article series process development for flux-free soldering we deal with temperature measurement, profiling, wetting and soldering tests....
03 Sep 2019 Process development for flux-free soldering with preforms (Part 2)
In part 2 of the article series "Process development for flux-free soldering", we deal with the solder alloy and the effective temperature of the reducing agent....
27 Aug 2019 Process development for flux-free soldering with preforms (Part 1)
Compared to standard reflow soldering with paste, the process development for paste-free soldering is much more elaborate. It is crucial to consider the quality requirements of the product from the very beginning. A preform is defined as a rolled metal sheet that consists solely of...
03 Aug 2019 Introduction to reliability and lifetime analysis of electronic systems and devices
This article describes the statistical reliability and lifetime analysis with the focus on electronic devices. It contents the basics of statistical methods. These include lifetime distributions for electronic components, hypothesis tests and quality of data characteristics. Practical data analysis is also part of this paper....
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