18 Sep 2024 Workshop presentation: Surface Finishes and Sinterable Metallisations
Presentation at the ECPE Hybrid Workshop Sinter Technology in Power Electronics....
11 May 2024 PCIM Seminar: Flux free soldering and pressure sintering
Finally, Bond Pulse will offer a public seminar....
16 Jan 2024 New article: Motivation for metallic sintering
Our new article on the motivation behind sintering power semiconductors was published today in Semiconductor Packaging News...
15 Aug 2023 Presentation about large area sintering and slot nozzle dispensing at FED Conference
Dr. Aaron Hutzler will present on large area sintering with copper and silver sintering paste in combination with slot nozzle dispensing...
08 May 2023 Sintering introduction support for newcomers
You are looking for sintering introduction support? We help you to find the best solution for your application....
02 Oct 2019 Meet Aaron Hutzler at the International Symposium on Advanced Power Packaging in Osaka, Japan
Aaron Hutzler will be speaking about soldering and sintering in controlled atmospheres at the ISAPP Conference in Osaka, Japan, focussing on the use of hydrogen atmospheres in combination with vacuum. ...
17 Apr 2019 Metallic sintering is like high-end baking
Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the...