Aaron Hutzler is an experienced expert, trainer and consultant within the electronics industry. He has developed and optimized new packaging technologies such as soldered and sintered assemblies as well as reliability and lifetime tests for more than 10 years, always using advanced statistical tools. Currently he is working on the improvement of production processes by data-mining and big-data techniques.
After his studies of material science (master of engineering) he worked at the Fraunhofer Institute for Integrated Systems and Device Technology IISB within the department power electronics systems. There, one of his achievements was a low inductance, double-sided cooled power module with SiC-MosFETs. In his Ph.D. thesis he investigated the lifetime of high temperature interconnects (silver sintering and gold germanium solders). Afterwards he became Head of Applications at the PINK GmbH Thermosysteme.
His strengths are:
Additionally, he has passed a six sigma green belt and a design for six sigma black belt training.
An overview over his publication can be found here.