Publications as founder of Bond Pulse since 2019
Publications as Head of Application at the PINK GmbH Thermosysteme 2016-2018
Rate-controlled Sintering: A High Yield Solution for Mass Production
Heraeus Sinter Seminar (Hanau, Germany), 10/2018
Warpage control of base plate soldering
Workgroup System Reliability at the Fraunhofer IZM (Berlin, Germany), 10/2018
Vacuum-assisted Sintering in Mass Production: Challenges and Solution
3D-PEIM Conference (Maryland, USA), 06/2018
Improvement of Power Module System Solders by Directional Solidification
CIPS Conference (Stuttgart, Germany), 03/2018
Silver Sintering in Mass Production
Presentation at the University of Tokyo (Tokyo, Japan), 01/2018
Publications as scientific staff at the Fraunhofer Institute for Integrated Systems and Device Technology IISB 2012-2016
Study on the power cycling capability of different die-attach materials at elevated temperatures
PhD thesis (Friedrich Alexander University of Erlangen-Nuremberg, Germany), 12/2019
Mechanical properties of silver-sintering bond lines
CIPS Conference (Nuremberg, Germany), 03/2016
Advanced measurement systeme analysis with design of experiements
Six Sigma Conference (Bayreuth, Germany), 03/2016
High Temperature Die-attach Materials for Aerospace Power Electronics
IEEE Aerospace Conference (Big Sky, USA), 03/2015
Increasing the lifetime of electronic packaging by higher temperatures
ECTC Conference (Orlando, USA), 05/2014
Power Cycling Community 1995-2014
Bodo’s Power Magazine (Germany), 05/2014
EuroSimE Conference (Ghent, Belgium) 04/2014
Increasing the lifetime of power modules by thinner bond wires
IMAPS Wire Bonding Workshop, (San Jose, USA), 01/2014
Extending the lifetime of power electronic assemblies by increased cooling temperatures
ESREF Conference, (Arcachon, France), 10/2013
Extending the power cycling lifetime of SiC diodes
ISiCPEAW Conference, Stockholm (Sweden), 06/2013
Statistical Analysis of Power Cycling Data
PCIM Conference, Nuremberg (Germany), 05/2013
Further publications of Aaron Hutzler are available at Fraunhofer Publica.