Publications of Aaron Hutzler

Publications as founder of Bond Pulse since 2019

Publications as Head of Application at the PINK GmbH Thermosysteme 2016-2018

Rate-controlled Sintering: A High Yield Solution for Mass Production

Heraeus Sinter Seminar (Hanau, Germany), 10/2018

Warpage control of base plate soldering

Workgroup System Reliability at the Fraunhofer IZM (Berlin, Germany), 10/2018

Vacuum-assisted Sintering in Mass Production: Challenges and Solution

3D-PEIM Conference (Maryland, USA), 06/2018

Improvement of Power Module System Solders by Directional Solidification

CIPS Conference (Stuttgart, Germany), 03/2018

Silver Sintering in Mass Production

Presentation at the University of Tokyo (Tokyo, Japan), 01/2018

Publications as scientific staff at the Fraunhofer Institute for Integrated Systems and Device Technology IISB 2012-2016

Mechanical properties of silver-sintering bond lines

CIPS Conference (Nuremberg, Germany), 03/2016

Advanced measurement systeme analysis with design of experiements

Six Sigma Conference (Bayreuth, Germany), 03/2016

High Temperature Die-attach Materials for Aerospace Power Electronics

IEEE Aerospace Conference (Big Sky, USA), 03/2015

Power Cycling Community 1995-2014

Bodo’s Power Magazine (Germany), 05/2014

Increasing the lifetime of power modules by thinner bond wires

IMAPS Wire Bonding Workshop, (San Jose, USA), 01/2014

Extending the power cycling lifetime of SiC diodes

ISiCPEAW Conference, Stockholm (Sweden), 06/2013

Statistical Analysis of Power Cycling Data

PCIM Conference, Nuremberg (Germany), 05/2013

Further publications of Aaron Hutzler are available at Fraunhofer Publica.