17 Apr 2019

Posted at 10:00h in Copper sintering, News, Paper, Silver sintering

Metallic sintering with silver or copper pastes to attach semiconductor dies, baseplates or coolers has replaced conventional soldering techniques within high-temperature applications. Devices with special requirements regarding lifetime and reliability include the sintering interconnects as well. For a better understanding of the sintering process, the...

17 Apr 2019

Posted at 08:16h in News, Paper, Vacuum soldering

Over the last 20 years, flux-free and paste-free vacuum soldering with preforms and formic acid has gained high importance for electronics packaging. Especially for big area solder joints within power modules for electric cars, this soldering technology can achieve void rates below 1%. This would...