Refers to a structure in power electronics consisting of ceramic substrates, power semiconductors and their contacting.

Al2O3-DCBs or AlN or Si3N4-AMBs with a copper layer on both sides are used for the ceramic circuit carriers. Depending on the connection technology, the copper can be silver-plated or nickel-plated.

The semiconductors are soldered or sintered onto the circuit carrier. Aluminum or copper bonding wires are usually used for top-side contacting. Hybrids of aluminum and copper are also possible.

For external contacting, load connections such as terminals are soldered or welded onto the copper.

For protection against environmental influences, the circuits are encapsulated with a silicone gel (soft encapsulation) and glued into a plastic housing or overmolded with an epoxy resin by transfer molding.

In many cases, the substrate is soldered or sintered onto a copper or aluminum base plate. These modules are referred to as base plate power modules. The base plates can in turn be manufactured with a cooling structure or a flat underside.