In electronics, refers to soldering processes in which hydrogen is used as a reducing agent to clean the surface oxides. At hydrogen concentrations of up to 5%, this is referred to as forming gas soldering. At higher concentrations, the process is referred to as hydrogen soldering. Nitrogen is used with hydrogen in various mixing ratios up to 100% H₂.

The chemical reaction results in the metal oxides being reduced by the hydrogen to carbon dioxide CO₂ and water H₂O, leaving behind the cleaned metal surface with which the solder then reacts.

Due to the explosive nature of hydrogen, appropriate safety technology is required for these systems. After the soldering process, the hydrogen used is either burned with a torch or mixed with nitrogen below the explosion limit. In some applications, the hydrogen is also recovered and reused.