Describes the thickness of a solder or sinter layer in µm. This thickness is important for the service life and reliability of the joining layer.

If the layer thickness is too thin, increased thermo-mechanical stresses occur in the joining partners during temperature cycling tests. In addition, the warping of the components can no longer be compensated for by the joining layer and delamination occurs. If the layer is too thick, the thermal resistance increases and the temperature in the component will rise.