The references of the presentation “Sintering under hydrogen – Evaluation of best process parameters by DOE” at the 2019 International Symposium on Advanced Power Packaging (ISAPP2019) are shown below.
[1] Aaron Hutzler, et. al: “Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering”, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
[2] Mattin Grao Txapartegi, e.t al: “Power Module Packaging 2018: Material Market and Technology Trends”, Market and technology report 2018 Yole Développement
[3] T. Suzuki et.al: “Macro- and Micro-Deformation Behavior of Sintered-Copper Die-Attach Material”, IEEE Transactions on Device and Materials Reliability, Volume: 18 , Issue: 1 , March 2018
[4] Dai Ishikawa et.al: “Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties”, 2018 7th Electronic System-Integration Technology Conference (ESTC).
[5] Jinjin Zhao, Min Yao, Ning-Cheng Lee: “Nano-Cu Sintering Paste for High Power Devices Die Attach Application”, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
[6] Yue Gao, et.al: “Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere”, Materials & Design, Volume 160, 15 December 2018, Pages 1265-1272
[7] Julian Kahler, et.al: “Sintering of Copper Particles for Die Attach”, IEEE Transactions on Components, Packaging and Manufacturing Technology ( Volume: 2 , Issue: 10 , Oct. 2012 ).
[8] Bao Ngoc An, et.al: “A highly integrated copper sintered SiC power module for fast switching operation”, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
[9] Kan Yasue, et.al: “Improvement of power cycling reliability of 3.3kV full-SiC power modules with sintered copper technology for Tj, max=175°C”, 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
[10] Wei Lin, Y.C. Lee: “Study of fluxless soldering using formic acid vapor”, IEEE Transactions on Advanced Packaging, Volume: 22 , Issue: 4 , Nov 1999
[11] Christine Dong, et.al: “Fluxless soldering in activated hydrogen atmosphere”, 2016 China Semiconductor Technology International Conference (CSTIC).
[12] S. Nagao, K. Kodani, S. Sakamoto, S.-W. Park, T. Sugahara, K. Suganuma: “Pressure-less plasma sintering of Cu paste for SiC die-attach of high-temperature power device manufacturing”, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
[13] Tetsu Takemasa, Jinting Jiu, Junko Seino, Katsuaki Suganuma: ”Improvement of Ag sintering Quality on Cu surface at Hydrogen atmosphere”, 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)