The references of the presentation “Sintering under hydrogen – Evaluation of best process parameters by DOE” at the 2019 International Symposium on Advanced Power Packaging (ISAPP2019) are shown below.
 Aaron Hutzler, et. al: “Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering”, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
 Yue Gao, et.al: “Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere”, Materials & Design, Volume 160, 15 December 2018, Pages 1265-1272
 Bao Ngoc An, et.al: “A highly integrated copper sintered SiC power module for fast switching operation”, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
 Kan Yasue, et.al: “Improvement of power cycling reliability of 3.3kV full-SiC power modules with sintered copper technology for Tj, max=175°C”, 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
 S. Nagao, K. Kodani, S. Sakamoto, S.-W. Park, T. Sugahara, K. Suganuma: “Pressure-less plasma sintering of Cu paste for SiC die-attach of high-temperature power device manufacturing”, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
 Tetsu Takemasa, Jinting Jiu, Junko Seino, Katsuaki Suganuma: ”Improvement of Ag sintering Quality on Cu surface at Hydrogen atmosphere”, 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)