Describes a soldering process using an overpressure chamber, similar to a vacuum chamber. An overpressure of 3…15 bar is applied during the liquid phase of the solder. As a result, possible defects can be compressed by the pressure and the void area in the solder joint is smaller.

Overpressure soldering is usually carried out in combination with vacuum soldering furnaces. The voids are first extracted using a vacuum and then the remaining defects are compressed to a minimum size using overpressure. Due to the more complex safety technology and design of the systems, this technique can only be considered if there are increased demands on the quality of the soldering joint.