Refers to the materials and production technologies used to bond electronic components onto circuit boards. Soldering components onto printed circuit boards is a classic bonding technique. Other joining techniques are welding, sintering and gluing.

The packaging technology must fulfill several functions of the assembly:

• Mechanical connection for fixing the components
• Electrical contacting of the circuit
• Thermal connection for heat dissipation

The functions are made possible by the choice of materials and joining techniques.