New article: Motivation for metallic sintering in power electronics

Our new article was published today in Semiconductor Packaging News, which takes a closer look at the motivation behind metallic sintering for connecting power semiconductors and models to heat sinks. The article can be found here: Semiconductor Packaging News

Abstracat

This technical paper explores the compelling motivations behind the alternative of pressure-assisted metallic sintering in the realm of power electronics. As the demand for more efficient and reliable Power Modules grows, this approach proves to be a high-quality solution, especially for silicon carbide SiC applications. The paper delves into the underlying principles, benefits, and potential applications of pressure-assisted metallic sintering and why it is a key technology to unleash the potential of Sic devices. The paper aims to provide a comprehensive understanding of the motivations and practical implications of pressure-assisted metallic sintering in the context of power electronics. By embracing this innovative technique, we pave the way for more robust, efficient, and reliable power electronic modules.