Used two or more cameras to measure the movement and deformation of components under mechanical load or temperature influence.

To do this, the surface must first be prepared with a pattern. For example, sprays are used to apply black and white dots to the object.

The test object is then subjected to the desired load. This can be a strain measurement using a tensile test or temperature using a heating plate. The two cameras use the initial sample as a reference and measure the displacement during the load test. Software is then utilized to calculate the strain or deformation as a function of the force or temperature.

In electronics production, this is used to measure circuit boards or heat sinks in order to determine their warpage during the joining process. The layer thickness for the solder or sintered joint can then be designed based on the deflection.