Refers to the non-destructive analysis of compound layers using ultrasound. Ultrasonic microscopy offers the possibility of analyzing solder and sintered layers in the µm range. It can be used to identify voids, pores, grooves, but also delamination and tilting. Scanning Acoustic Microscopy (SAM) also offers the option of outputting images for different sound propagation times. This means that a component can be divided into any number of layers or images in the Z direction. This so-called C-scan or C-SAM is useful for checking boundary layers for defects and detecting delamination, for example.

The only disadvantage of ultrasonic microscopy is that water is required as a coupling medium. This means that the components are contaminated during the test and have to be dried again afterwards.