Describes a standard quality test for die-attaches such as solder layers or sinter layers. The semiconductor or dummy is sheared off the solder layer. For solder layers, shear forces of 30 MPa are a good rule of thumb, while for sintered layers the value should be above 40 MPa, preferably 50 MPa. On the other hand, shear values above 100 MPa are undesirable, as otherwise the joint is too strong and cannot compensate for stresses in the layer structure. This can lead to fractures in the joining partners.